Advanced MEMS packaging - download pdf or read online

By John H. Lau ... [et al.]

ISBN-10: 0071626239

ISBN-13: 9780071626231

ISBN-10: 0071627928

ISBN-13: 9780071627924

ISBN-10: 0071741836

ISBN-13: 9780071741835

ISBN-10: 1615831592

ISBN-13: 9781615831593

Creation to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complex MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble swap --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

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Extra info for Advanced MEMS packaging

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Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates,” Patel, Satyadev R. (US), Huibers, Andrew G. (US) (+1), US2007001247 (A1)—2007-01-04. 111. “Two-freedom air-floated precisely locating platform for IC packaging,” Zhang, Dawei (CN), CN1887686 (A)—2007-01-03. 112. “MEMS package,” Yoshikawa, Yasuhiro, Tajiri, Hiroyuki, JP2006321016 (A)—2006-11-30. 113. , KR20010051498 (A)—200106-25. 114. “Method of packaging MEMS,” Ouellet, Luc (CA), Chowdhury, Mamur (CA), EP1734001 (A2)—2006-12-20.

MacDonald, Noel C. (Santa Barbara, CA), Aimi, Marco F. (Goleta, CA), “Metal MEMS devices and methods of making same,” January 23, 2007. Tarn, Terry (San Diego, CA), “Device packages with low stress assembly process,” January 16, 2007. Chiao, Mu (Beaverton, OR), Lin, Liwei (Castro Valley, CA), Lam, Kien-Bang (Albany, CA), “Implantable, miniaturized microbial fuel cell,” January 9, 2007. Wei, Jun (Singapore, SG), Wong, Stephen Chee Khuen (Singapore, SG), Wu, Yongling (Singapore, SG), Ng, Fern Lan (Singapore, SG), “Method of fabricating microelectromechanical system structures,” December 26, 2006.

107. “MEMS packaging method for enhanced EMI immunity using flexible substrates,” Wang, Zhe (SG), Miao, Yubo (SG), US2007013052 (A1)—2007-01-18. 108. “Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging,” Nasiri, Steven S. , Jr. (US), US2007012653 (A1)—2007-01-18. 33 34 Chapter One 109. “Method and system for packaging MEMS devices with incorporated getter,” Palmateer, Lauren (US), Cummings, William J. (US) (+3), KR20060092914 (A)—2006-08-23.

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Advanced MEMS packaging by John H. Lau ... [et al.]


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