Download PDF by John Lau, Cheng Lee, C. Premachandran, Yu Aibin: Advanced MEMS Packaging (Electronic Engineering)

By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

ISBN-10: 0071626239

ISBN-13: 9780071626231

A complete advisor to 3D MEMS packaging tools and recommendations Written by way of specialists within the box, complex MEMS Packaging serves as a beneficial reference for these confronted with the demanding situations created via the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant provides state of the art MEMS (microelectromechanical platforms) packaging suggestions, corresponding to low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you decide trustworthy, inventive, high-performance, powerful, and in your price range packaging strategies for MEMS units. The booklet also will relief in stimulating extra learn and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, approaches, production, trying out, and reliability. one of the subject matters explored: complex IC and MEMS packaging traits MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding options Actuation mechanisms and built-in micromachining Bubble change, optical swap, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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Packaging of Micro Devices,” O’Mahony, Conor (IE), Hill, Martin (IE), US2008145976 (A1)—2008-06-19. 36. “High-aspect-ratio metal-polymer composite structures for nano interconnects,” Aggarwal, Ankur (US), Raj, Pulugurtha Markondeya (US) (+1), US2008136035 (A1)—2008-06-12. 37. “MEMS package and packaging method thereof,” Jung, Sung-Hae (KR), Lee, Myung-Lae (KR) (+4), WO2008069394 (A1)—2008-06-12. 38. “Integrated thermal systems,” Henderson, H. Thurman (US), Shuja, Ahmed (US) (+3), US2008128898 (A1)—2008-06-05.

Platt, William P. (Columbia Heights, MN), Ford, Carol M. (Columbia Heights, MN), “Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices,” November 7, 2006. Sherrer, David W. (Radford, VA), Rasnake, Larry J. (Blacksburg, VA), Fisher, John J. (Blacksburg, VA), “Device package and method for the fabrication and testing thereof,” October 31, 2006. Wei, Jun (Singapore, SG), Wong, Stephen Chee Khuen (Singapore, SG), Nai, Sharon Mui Ling (Singapore, SG), “Anodic bonding process for ceramics,” October 3, 2006.

114. “Method of packaging MEMS,” Ouellet, Luc (CA), Chowdhury, Mamur (CA), EP1734001 (A2)—2006-12-20. 115. “Display device having a movable structure for modulating light and method thereof,” Miles, Mark W. (US), US2006274074 (A1)—2006-12-07. 116. “Production method of glass penetrating wiring board, glass penetrating wiring board, and probe card and packaging element using glass penetrating wiring board,” Fujimoto, Satoshi (JP), WO2006129848 (A1)—2006-12-07. 117. “X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging,” Nasiri, Steve S.

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Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin


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